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TC3531
REV4_20060525
5.8 GHz 1W MMIC
FEATURES * * * * * * P-1 dB: 30 dBm Small Signal Gain: 24 dB Power Added Efficiency: 24 % IP3: 39 dBm Match to 50 Operation Bias condition: 600 mA @ 7 V PHOTO ENLARGEMENT
GND GND RF IN Vd1 Vd2 Vg1 Vg2 RF OUT NC GND
DESCRIPTION
The TC3531 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume 5.7-5.9 GHz band applications. The MMIC is matched to 50 operation. No external matching component is required. It provides a typical gain of 24 dB and P1 dB power of 30 dBm. Typical bias condition is 7V at 600 mA. The MMIC is a packaged in a copper based ceramic 10 pins power package. The copper based carrier of the package allows direct soldering of the device to the PCB for proper heat sinking.
APPLICATIONS * Wireless Internet Access
ELECTRICAL SPECIFICATIONS (Ta = 25 C)
SYMBOL FREQ SSG P-1 dB P-3 dB IP3 VSWR, IN VDD Vg IDD IDP-1 a DESCRIPTION Frequency Range Small Signal Gain Output Power at 1 dB Gain Compression Output Power at 3 dB Gain Compression Third Order Intercept Point Input VSWR Supply Voltage Gate Voltage Current Supply Without RF Current Supply @ Pout = P-1 dB Power Added Efficiency -0.6 MIN 5.7 22 29 30 37 24 30 31 39 2:1 7 -1.0 600 620 24 -2 TYP MAX 5.9 UNITS GHz dB dBm dBm dBm Volt Volt mA mA %
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/3
TC3531
REV4_20060516
Absolute Maximum Ratings
Symbol Vdd Idd Pin Pt Tch TSTG Parameter/Conditions Drain-Source Voltage Total Drain Current RF Input Power Power Dissipation Operating Channel Temperature Storage Temperature Min. Max. 12 1600 11 7 175
175
Units Volts mA dBm W
C C
Note:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice.
-65
TEST CIRCUITS Evaluation Board Schematic
EVALUATION BOARD
PCB Material: RO4003 ER = 3.38 Thickness = 20 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw
* Application Notes:
For better heat sinking and grounding, it's recommended to have the via holes beneath TC3531 filled with solder and have two screws besides TC3531
installed on the PCB area.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P2/2
TC3531
REV4_20060525
Evaluation Board Parts List
Part Type Capacitor Capacitor Capacitor Resistor Reference Designator C1, C2, C3 C4, C5 C6, C7 R1 Description 1000pF 0603 0.1 uF 0603 4.7uF Tantalum Cap. 200 ohm 0603 Manufacturer Murata Murata Part Number GRM39C0G102J50V GRM39Y5V104Z25V
CONNECTION DIAGRAM AND PIN DESCRIPTIONS
Pin # 1, 2, 6 3 4, 5 9, 10 8 7 Name GND RF IN Vd Vg RF OUT NC Description Ground RF input (internally DC blocked) Input stage drain bias FET gate bias RF output and Vd2 External matching circuit required No Connection
GND GND RF IN 50 ohm LINE
1 2 3 4
10 Vg 9 8 7 6 * NC GND 50 ohm LINE RF OUT
Vd 5
PHYSICAL DIMENSIONS (Unit: inch)
H J C
DIMENSION MINIMUM NOMINAL MAXIMUM
E
I
TC3531
B A
0.002MAX
G
A B C D E F G H I J
0.054 0.007 0.017 0.267 0.047 0.247 0.267 0.007 0.020 0.073 0
0.057 0.008 0.020 0.270 0.050 0.250 0.270 0.008 0.080
0.060 0.009 0.023 0.273 0.053 0.253 0.273 0.009 0.040 0.087 7
F
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P3/3
D

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